structure | High-level multi-layer arbitrary-order HDI structure |
number of layers | 20 floors |
umber of pressings | 9time |
Minimum drilling hole diameter | 0.075mm(laser drilling) |
Interlayer offset accuracy | ±0.05mm |
Outline dimensional accuracy | ±0.05mm |
Surface treatment method | ENIG |
20-layer arbitrary interconnection substrate
Interconnection at any layer simplifies wiring complexity, achieving high-density integration without requiring complex graphics.
Graph optimization reduces manufacturing difficulty, shortens production cycle, and improves yield rate.
Streamline the structure to reduce material waste, while balancing high performance and cost control.
Low-complexity graphics reduce signal interference, ensuring stable operation in high-frequency scenarios.
The simplified design rules are adaptable to a wide range of scenarios, enabling efficient deployment from consumer electronics to industrial control.
Special material for multiple press-fitting, ensuring reliability.
Graph optimization reduces manufacturing difficulty, shortens production cycle, and improves yield rate.
Streamline the structure to reduce material waste, while balancing high performance and cost control.
Low-complexity graphics reduce signal interference, ensuring stable operation in high-frequency scenarios.
The simplified design rules are adaptable to a wide range of scenarios, enabling efficient deployment from consumer electronics to industrial control.
Special material for multiple press-fitting, ensuring reliability.
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Description