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Keep Your Balls Clean And Your Woods

About Our Company

Fuji Innovation Inc. is a wholly owned subsidiary of First Quality Circuit (FQC), a high-end PCB manufacturer based in Thailand, established to serve customers in the United States and North America with localized business operations, engineering expertise, and quality support.

Headquartered in California, USA, Fuji Innovation serves as FQC’s key interface to the North American market. We provide efficient, professional, and sustainable support to customers in industries with stringent requirements for reliability and consistency, including Artificial Intelligence (AI), optical modules, automotive electronics, telecommunications, and medical electronics.

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What houses we build

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Our advantages

Why Choose Us

We work directly for our clients and put client’s interests first. Innovation Guides Us As Always

01

Professional Builders

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02

Best Wooden Materials

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03

High Speed Construction

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Why Choose Us

Guarantee Of Durability

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04

Professional Team

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05

One Stop Service

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06

Popular Products

Our Products

We work directly for our clients and put client’s interests first. Innovation Guides Us As Always

  • OSFP800 800G optical module
    OSFP800 800G optical module

    structureAnylayer HDI structurenumber of layers10-layer arbitrary-order HDIplate thickness1.0±0.1mmline widthinner and outer layers 3Minimum drilling hole diameter0.10mm (laser drilling) / 0.15mm (mechanical drilling)Minimum weld bead width3milimpedance requirement100Ω±7Ωplate thickness to apert...

  • rigid-flex board
    rigid-flex board

    structure Multi-layer flexible paging or bonding structure, HDI structure number of layers 2-28layerMinimum width of flexible zone 3mmline width Inner layer 2/2mil, outer layer 2/2milMinimum drilling hole diameter 0.05mm (laser drilling) / 0.15mm (mechanical drilling)Minimum weld loop width 4milHole...

  • Multi-layer back-drilled substrate
    Multi-layer back-drilled substrate

    structureMulti-layer back-drilled substrate, HDI structurenumber of layers12-50layerplate thickness1.6-5.4mmline widthInner layer 3/3mil, outer layer 3.5/3.5milMinimum drilling hole diameter0.10mm (laser drilling) / 0.15mm (mechanical drilling)Minimum weld bead width3milHole-to-conductor spacing5mil...

  • 20-layer arbitrary interconnection substrate
    20-layer arbitrary interconnection substrate

    structureHigh-level multi-layer arbitrary-order HDI structurenumber of layers20 floorsumber of pressings9timeMinimum drilling hole diameter0.075mm(laser drilling)Interlayer offset accuracy±0.05mmOutline dimensional accuracy±0.05mmSurface treatment methodENIG...

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