structure | Multi-layer back-drilled substrate, HDI structure |
number of layers | 12-50layer |
plate thickness | 1.6-5.4mm |
line width | Inner layer 3/3mil, outer layer 3.5/3.5mil |
Minimum drilling hole diameter | 0.10mm (laser drilling) / 0.15mm (mechanical drilling) |
Minimum weld bead width | 3mil |
Hole-to-conductor spacing | 5mil for 20 layers and below, 6mil for 20 to 50 layers, and 7mil for 50 layers and above |
plate thickness to aperture ratio | 1:1 (blind hole); 27:1 (through hole) |
Outline dimensional accuracy | ±0.10mm (special±0.05mm) |
Surface treatment method | ENIG, ENEPIG, FLASH GOLD, HARD GOLD, OSP |
Multi-layer back-drilled substrate
High-speed signal transmission with low loss
High number of layers, high thickness-to-diameter ratio
Multi-level back drilling depth control process
High number of layers, high thickness-to-diameter ratio
Multi-level back drilling depth control process
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Description