structure | Anylayer HDI structure |
number of layers | 10-layer arbitrary-order HDI |
plate thickness | 1.0±0.1mm |
line width | inner and outer layers 3 |
Minimum drilling hole diameter | 0.10mm (laser drilling) / 0.15mm (mechanical drilling) |
Minimum weld bead width | 3mil |
impedance requirement | 100Ω±7Ω |
plate thickness to aperture ratio | 1:0.75(blind hole) |
Outline dimensional accuracy | ±0.08mm (special±0.05mm) |
Solder mask requirements | Low DK sun PSR-4000 D10ME |
Surface treatment method | ENEPIG |
OSFP800 800G optical module
M7 grade material, high frequency and high speed
Line width spacing ≤ 3mil, dense wiring
Nickel palladium gold process
Segmented gold finger
DIE/Wire bonding
Line width spacing ≤ 3mil, dense wiring
Nickel palladium gold process
Segmented gold finger
DIE/Wire bonding
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Description