structure | Multi-layer flexible paging or bonding structure, HDI structure |
number of layers | 2-28layer |
Minimum width of flexible zone | 3mm |
line width | Inner layer 2/2mil, outer layer 2/2mil |
Minimum drilling hole diameter | 0.05mm (laser drilling) / 0.15mm (mechanical drilling) |
Minimum weld loop width | 4mil |
Hole-to-conductor spacing | 5mil for 6 layers and below, 6mil for 7 to 11 layers, and 8mil for 12 layers and above |
plate thickness to aperture ratio | 1:1(blind hole); 20:1(through hole) |
Outline dimensional accuracy | ±0.10mm (special±0.05mm) |
Surface treatment method | ENIG, ENEPIG, HASL、 FLASH GOLD, HARD GOLD, OSP |
rigid-flex board
"Modular design" and "three-dimensional installation" are available
Reduce the weight of the entire product
High-density wiring, thinning, and lightweight
High reliability applications
Perform dynamic bending to varying degrees as needed
Reduce the weight of the entire product
High-density wiring, thinning, and lightweight
High reliability applications
Perform dynamic bending to varying degrees as needed
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Description